Description

KVS Red Glue is a kind of polyene organic compound. Compared to solder paste, the red glue will cure after it is heated. Its curing point is 150℃, after this, it immediately changes from paste to solid. Its outstanding curing speed, high heat-resistivity, and excellent electric properties make this a vital component in soldering. It is ideal for processing KVS series during wave soldering processes.

Specifications before curing

Item Testing condition Properties
Composition – Epoxy resin
Appearance Visual inspection Red color gel
Homogeneity 25℃, fineness meter < 100μm
Gravity 25℃ 1.25 g/cm³
Viscosity 25℃, 5rpm 450,000cps
Trixtropy Index 1rpm/10rpm 6.7
Yield Value 25℃, Haak RV1 Cone plate rheometer, PK100,PK1/1o 300～650Pa
CASSON Viscosity Same as above 0.15～1.8PaS
Application process – Screen printing, dispensing machine
 

Recommended curing condition
The recommended curing condition is 90～120 sec after surface temperature has reached 150℃, or 160～180 sec after surface temperature has reached 120℃. The highest curing temperature should not exceed 200 ℃. The ideal curing condition depends on the curing furnace. With a higher curing temperature and longer curing time, the stronger the adhesive strength. The typical curing curve of red glue is as follows:

Specifications after curing

Item Testing condition Properties
Adhesive property Lap shear strength 25℃,steel – steel >15MPa Mpa
Thrust 25℃， C1206-FR4 copper plate >40 N
Tg TMA 80℃
Adhesive spot diameter growth in curing SJ/T 11187-1998 < 10%
thermal expansion coefficient α1 TMA 60×10 -6 K -1
α2 120×10 -6 K -1
Volume resistance 25℃ 2.2×1015 Ω·cm
Surface resistance 25℃ 2.2×1015 Ω
Dielectric strength 25℃ 25 KV/mm
Dielectric constant 25℃, 1MHz 3.2
Dielectric loss angle tangent 25℃, 1MHz < 0.02